Variations in hoop stresses among silicon dioxide, polystyrene and polypropylene carbonate through silicon via liners

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dc.contributor.author Juma, Mary A.
dc.contributor.author Zhang, Xuliang
dc.contributor.author Bai, He S.
dc.date.accessioned 2022-01-13T09:34:43Z
dc.date.available 2022-01-13T09:34:43Z
dc.date.issued 2015-12
dc.identifier.citation IEEE Advanced Information Technology, Electronics and Automation Control Conference, IAEAC en_US
dc.identifier.uri https://www.atlantis-press.com/article/25843921.pdf
dc.identifier.uri http://repository.seku.ac.ke/handle/123456789/6682
dc.description Joint International Mechanical, Electronic and Information Technology Conference (JIMET 2015) en_US
dc.description.abstract Through Silicon Via are the widely used interconnects in the semiconductors industry. They are designed in different ways to meet the market demands. These interconnect need protection from both internal and external pressures. The pressures result from heating of the components on the chip which enhances expansion and contraction. Silicon dioxide has been the commonly used Through Silicon Via liner. We propose the use of polystyrene and polypropylene carbonate as liners to reduce overdependence on silicon dioxide. We compare deformations and stresses among the materials and noted that silicon dioxide had the least deformation and hoop stress values. We did further research and realized that the latter two materials have some good properties not found in silicon dioxide so they can also serve as better liners. en_US
dc.language.iso en en_US
dc.publisher Atlantis Press en_US
dc.subject Analysis System en_US
dc.subject Interconnect en_US
dc.subject Liner en_US
dc.subject Reliability en_US
dc.subject Through Silicon Via en_US
dc.title Variations in hoop stresses among silicon dioxide, polystyrene and polypropylene carbonate through silicon via liners en_US
dc.type Presentation en_US


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