One of the most common forms of failures observed in flipchips brittle thin films subjected to stress is cracking. The crack growth rate depends on intrinsic film properties, stress and some environmental factors. In part ...

Through silicon via (TSV) interconnect reliability is a problem in electronic packaging. The authors address the insertion losses, deflections which can result to separation of TSV layers and hoop stresses. These problems ...

Online gait control in human-powered exoskeleton systems is still rich research field and represents a step towards fully autonomous, safe and intelligent navigation. Admittance Controller performs well on flat terrain walking ...