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Browsing by Author Xuliang, Zhang

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Issue Date	Title	Author(s)
2014-04	Assessing central cracks and interconnect reliability in flipchips	Juma, Mary A.; Xuliang, Zhang
2014	Assessing cracks and interconnect reliability in flipchips	Juma, Mary A.; Xuliang, Zhang
2014-09	Assessing the interconnect reliability, stress and deformation around via in flip chips	Juma, Mary A.; Xuliang, Zhang
2015	Optimization of deformations and hoop stresses in TSV liners to boost interconnect reliability in electronic appliances	Juma, Mary A.; Xuliang, Zhang; Bai, He S.; Ahmed, I. A. A.

Showing results 1 to 4 of 4