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Browsing by Author "Bai, He S."

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Effects of varying the through silicon via liners thickness on their hoop stresses and deflections

Juma, Mary A.; Zhang, Xuliang; Bai, He S. (IET, 2017-04)

Through silicon via (TSV) interconnect reliability is a problem in electronic packaging. The authors address the insertion losses, deflections which can result to separation of TSV layers and hoop stresses. These problems ...
Hoop stress development on silicon dioxide liner in through silicon via

Juma, Mary A.; Zhang, Xuliang; Bai, He S. (IEEE, 2015)

Through Silicon Via Interconnects are usually protected with liners. A research on liners was done and conclusion made that they experience reliability problems like hoop stress which put them and the Through Silicon Via ...
Optimization of deformations and hoop stresses in TSV liners to boost interconnect reliability in electronic appliances

Juma, Mary A.; Xuliang, Zhang; Bai, He S.; Ahmed, I. A. A. (International Society for Optics and Photonics, 2015)

Recently, there has been a lot of research with electronic products because more and different functions are integrated into devices and the final product sizes have to be small to meet the market demand. A lot of research ...
S-parameters optimization in both segmented and unsegmented insulated TSV

Juma, Mary A.; Zhang, Xuliang; Bai, He S. (IEEE, 2016-11)

A segmented and unsegmented 3D insulated copper through silicon vias (TSVs) of diameter 10μm, height 100μm and silicon of sizes 100μm by 100μm by 100μm are modelled using analysis system (ANSYS) and equivalent circuit using ...
Variations in hoop stresses among silicon dioxide, polystyrene and polypropylene carbonate through silicon via liners

Juma, Mary A.; Zhang, Xuliang; Bai, He S. (Atlantis Press, 2015-12)

Through Silicon Via are the widely used interconnects in the semiconductors industry. They are designed in different ways to meet the market demands. These interconnect need protection from both internal and external ...

Browsing by Author "Bai, He S."

Browsing by Author "Bai, He S."

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