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Browsing by Author "Juma, Mary A."

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Assessing central cracks and interconnect reliability in flipchips

Juma, Mary A.; Xuliang, Zhang (2014-04)

one of the most common forms of failures observed in brittle thin films subjected to stress is cracking. The crack growth rate depends on intrinsic film properties, stress and some environmental factors. we investigate ...
Assessing cracks and interconnect reliability in flipchips

Juma, Mary A.; Xuliang, Zhang (2014)

One of the most common forms of failures observed in flipchips brittle thin films subjected to stress is cracking. The crack growth rate depends on intrinsic film properties, stress and some environmental factors. In part ...
Assessing the interconnect reliability, stress and deformation around via in flip chips

Juma, Mary A.; Xuliang, Zhang (2014-09)

Analysis System (ANSYS) Tutorial, two dimensional (2D) fracture analysis release 14.0 helped us develop new ideas about stress development and deformation around via in flip chips. The chips are from five different materials ...
Automatic low-cost water level indicator for tanks and hand washing water dispensers in Kitui; Kenya during the covid 19 pandemic

Juma, Mary A.; Ahmed, Abusabah; Kussia, Bulbula K.; Kuya, Sammy (2022-12-31)

In day to day life, millions and millions of liters of water is being wasted through overflowing or excessive usage. In Kitui specifically, water availability by itself a challenge since the area rarely ...
Effects of varying the through silicon via liners thickness on their hoop stresses and deflections

Juma, Mary A.; Zhang, Xuliang; Bai, He S. (IET, 2017-04)

Through silicon via (TSV) interconnect reliability is a problem in electronic packaging. The authors address the insertion losses, deflections which can result to separation of TSV layers and hoop stresses. These problems ...
Hoop stress development on silicon dioxide liner in through silicon via

Juma, Mary A.; Zhang, Xuliang; Bai, He S. (IEEE, 2015)

Through Silicon Via Interconnects are usually protected with liners. A research on liners was done and conclusion made that they experience reliability problems like hoop stress which put them and the Through Silicon Via ...
Interaction force convex reduction for smooth gait transitions on human-power augmentation lower exoskeletons

Ahmed, Abusabah I. A.; Cheng, Hong; Liu, Huaping; Lin, Xichuan; Juma, Mary A. (Springer, Singapore, 2017-07)

Online gait control in human-powered exoskeleton systems is still rich research field and represents a step towards fully autonomous, safe and intelligent navigation. Many Control method performs well and with accepted ...
Optimization of deformations and hoop stresses in TSV liners to boost interconnect reliability in electronic appliances

Juma, Mary A.; Xuliang, Zhang; Bai, He S.; Ahmed, I. A. A. (International Society for Optics and Photonics, 2015)

Recently, there has been a lot of research with electronic products because more and different functions are integrated into devices and the final product sizes have to be small to meet the market demand. A lot of research ...
S-parameters optimization in both segmented and unsegmented insulated TSV

Juma, Mary A.; Zhang, Xuliang; Bai, He S. (IEEE, 2016-11)

A segmented and unsegmented 3D insulated copper through silicon vias (TSVs) of diameter 10μm, height 100μm and silicon of sizes 100μm by 100μm by 100μm are modelled using analysis system (ANSYS) and equivalent circuit using ...
Survey of on-line control strategies of human-powered augmentation exoskeleton systems

Ahmed, A.I.A.; Cheng, H.; Lin, X.; Omer, M.; Juma, Mary A. (Hilaris, 2016)

On-line gait control in human-powered exoskeleton systems is still rich research field and represents a step towards fully autonomous, safe and intelligent indoor and outdoor navigation. It is still a big challenge to ...
Variable admittance control for climbing stairs in human-powered exoskeleton systems

Ahmed, A. I. A.; Cheng, H.; Lin, X.; Omer, M.; Juma, Mary A. (Hilaris, 2016)

Online gait control in human-powered exoskeleton systems is still rich research field and represents a step towards fully autonomous, safe and intelligent navigation. Admittance Controller performs well on flat terrain walking ...
Variations in hoop stresses among silicon dioxide, polystyrene and polypropylene carbonate through silicon via liners

Juma, Mary A.; Zhang, Xuliang; Bai, He S. (Atlantis Press, 2015-12)

Through Silicon Via are the widely used interconnects in the semiconductors industry. They are designed in different ways to meet the market demands. These interconnect need protection from both internal and external ...

Browsing by Author "Juma, Mary A."

Browsing by Author "Juma, Mary A."

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