Analysis System (ANSYS) Tutorial, two dimensional (2D) fracture analysis release 14.0 helped us develop new ideas about stress development and deformation around via in flip chips. The chips are from five different materials ...

Recently, there has been a lot of research with electronic products because more and different functions are integrated into devices and the final product sizes have to be small to meet the market demand. A lot of research ...

Through Silicon Via are the widely used interconnects in the semiconductors industry. They are designed in different ways to meet the market demands. These interconnect need protection from both internal and external ...